Advanced Computing in the Age of AI | Friday, August 12, 2022

interconnects

CXL Brings Datacenter-sized Computing with 3.0 Standard, Thinks Ahead to 4.0

A new version of a standard backed by major cloud providers and chip companies could change the way some of the world’s largest datacenters and fastest supercomputers are built. ...Full Article

AMD Unveils Speedier Chiplet Design With High-Bandwidth Interconnects

Advanced Micro Devices is accelerating the GPU chiplet race with the release of a U.S. patent application for a device that incorporates high-bandwidth interconnects between processing elements. AMD and ...Full Article

Intel Omni-Path Interconnect: One and Done

Intel Corp.’s plans to make a big splash in the network fabric market for linking HPC, AI and other high performance workloads has apparently belly-flopped. The chip maker confirmed to ...Full Article

Kubernetes Seen Driving Bare-Metal Comeback

Hardware vendors are betting the transition to 5G wireless networks supporting myriad connected consumer and industrial devices also will accelerate the shift to heavy-duty bare-metal servers as a way ...Full Article

Chip Makers Look Beyond Accelerators to ‘Balanced’ Systems

The Cambrian explosion of about 500 million years ago is a popular metaphor for the tail end of Moore’s Law scaling and the emergence of a variety of processing ...Full Article
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