Archives
Ramon.Space Raises $17.5M Series A for Supercomputing in Space
May 25th, 2021
PALO ALTO, Calif. and YOKNEAM, Israel, May 25, 2021 -- Ramon.Space, a world leader in space computing solutions, has raised $17.5M in Series A funding. The round includes StageOne Ventures, Deep Insight, WorldQuant Ventures, UMC Capital and existing investor ...
PLDA Announces XpressRICH PCI Express 6.0 Controller IP for Next Gen SoC Designs
May 25th, 2021
May 25, 2021 -- PLDA, a leading developer of high-speed interconnect silicon IP, today announced the launch of their XpressRICH PCI Express (PCIe) Controller IP for the PCIe 6.0 specification. The PCIe 6.0 specification provides an evolutionary step forward ...
Kao Data Becomes NVIDIA DGX-Ready
May 25th, 2021
LONDON, May 25, 2021 -- Kao Data, the specialist developer and operator of advanced, carrier neutral data centres for high performance colocation, has today announced it has become NVIDIA DGX-Ready Data Center certified. This step further reinforces its capabilities ...
ADLINK Unveils PC/104 Module with Quadro P1000 Graphics Processing from NVIDIA
May 25th, 2021
TAIPEI, Taiwan, May 25, 2021 -- ADLINK Technology Inc., a global leader in edge computing, launched today the CM5-P1000 module, expanding the company’s advanced solutions for artificial intelligence-enabled mission-critical applications. Supplied in a PCIe/104 Type 1 format (measuring 116mm ...
Cadence Announces Third-Gen 112G-LR SerDes IP on TSMC’s N5 Process
May 24th, 2021
SAN JOSE, Calif., May 24, 2021 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its third-generation 112G long-reach (112G-LR) SerDes IP on TSMC’s N5 process for hyperscale ASICs, artificial intelligence/machine learning (AI/ML) accelerators, and switch fabric systems on ...
UL Joins Open Compute Project to Further Enable Data Center and Enterprise System Designs
May 24th, 2021
NORTHBROOK, Ill., May 24, 2021 -- UL, a global safety science leader, today announced that it has joined the Open Compute Project (OCP). UL joined the organization at the highest tier level and will contribute its technical knowledge and ...
GUC Announces GLink-3D Die-on-Die Interface IP Using TSMC N5, N6 Process
May 24th, 2021
HSINCHU, Taiwan, May 24, 2021 -- Global Unichip Corp. (GUC), an Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand ...
BrainChip Execs Discuss Putting AI on Sensors at the Edge at Embedded Vision Summit
May 21st, 2021
ALISO VIEJO, Calif., May 21, 2021 -- BrainChip Holdings Ltd. (ASX: BRN), (OTCQX: BRCHF), a leading provider of ultra-low power, high-performance AI technology, will present the Expert Bar session “Can You Put AI at the Sensor? (Not the Edge ...
Altair Future.AI Global Simulation, HPC, AI Event to Be Held June 15-17
May 21st, 2021
TROY, Mich., May 21, 2021 -- Altair, a global technology company providing solutions in simulation, high-performance computing (HPC), and artificial intelligence (AI) will hold its Future.AI event, June 15-17. This virtual event will showcase advances in analytics and AI ...
Numenta Demonstrates 100x Performance Acceleration in Deep Learning Networks Using Sparse Techniques
May 21st, 2021
REDWOOD CITY, Calif., May 21, 2021 -- Numenta, Inc. announced it has achieved greater than 100x performance improvements on inference tasks in deep learning networks without any loss in accuracy. In a new white paper released, Numenta detailed how ...