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Lightmatter Names TPU Engineer Richard Ho as VP of Hardware Engineering
August 23rd, 2022 Comments Off on Lightmatter Names TPU Engineer Richard Ho as VP of Hardware Engineering
BOSTON, Aug. 23, 2022 — Lightmatter, a leader in photonic computing, has named its new Vice President of Hardware Engineering, Richard Ho, who spent nearly 9 years at Google leading the revolutionary Cloud Tensor Processing Units (TPU) project. Ho will ...

Fabio Vernillo from Avanea Joins Tachyum Board of Observers
August 23rd, 2022 Comments Off on Fabio Vernillo from Avanea Joins Tachyum Board of Observers
LAS VEGAS, Aug. 23, 2022 – Tachyum today announced that it has formed a Board of Observers with Fabio Vernillo, head of investments for Avanea, as its first member. Avanea is a next-generation asset manager founded by IPM Group. Vernillo brings ...

RAID Inc. Announces 20TB HDDs Fully Qualified for Ability 84-Bay and 106-Bay EBODs
August 23rd, 2022 Comments Off on RAID Inc. Announces 20TB HDDs Fully Qualified for Ability 84-Bay and 106-Bay EBODs
LAWRENCE, Mass., Aug. 23, 2022 -- RAID Incorporated, a leader in designing and implementing customized high-performance storage solutions for HPC, big data, cloud, and software-defined data centers, today announced the qualification of 20TB HDD drives. The HDD drives can ...

Intel Announces Semiconductor Co-Investment Program to Help Fund Manufacturing Build-outs
August 23rd, 2022 Comments Off on Intel Announces Semiconductor Co-Investment Program to Help Fund Manufacturing Build-outs
SANTA CLARA, Calif., Aug. 23, 2022 – Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of its program, Intel has signed a definitive agreement with the ...

Intel Highlights Latest Innovations at Hot Chips 34
August 23rd, 2022 Comments Off on Intel Highlights Latest Innovations at Hot Chips 34
Aug. 23, 2022 — At Hot Chips 34, Intel highlights the latest architectural and packaging innovations enabling the 2.5D and 3D tile-based chip designs that will bring about a new era in chipmaking and propel Moore’s Law forward for years to ...

Accenture Releases Life Sciences Technology Vision 2022 Report
August 22nd, 2022 Comments Off on Accenture Releases Life Sciences Technology Vision 2022 Report
NEW YORK, Aug. 22, 2022 -- Accenture’s Life Sciences Technology Vision 2022 report explores the technology trends that will transform how biopharmaceutical and medical technology companies solve manufacturing and device problems, improve equity in clinical trial participation and build ...

Researchers Design New Neuromorphic Chip for AI on the Edge
August 19th, 2022 Comments Off on Researchers Design New Neuromorphic Chip for AI on the Edge
Aug. 19, 2022 — An international team of researchers has designed and built a chip that runs computations directly in memory and can run a wide variety of AI applications–all at a fraction of the energy consumed by computing ...

Torch.AI Partners with Vertosoft to Optimize Data Infrastructure Across US Government
August 18th, 2022 Comments Off on Torch.AI Partners with Vertosoft to Optimize Data Infrastructure Across US Government
LEAWOOD, Kan., Aug. 18, 2022 -- Torch.AI today announced a partnership with Vertosoft to accelerate the adoption of next-generation artificial intelligence (AI) and data infrastructure software capabilities across the U.S. Government. Torch.AI, already supporting some of the world's most ...

Syslogic Offers NVIDIA Jetson-Based Embedded System for Railway
August 18th, 2022 Comments Off on Syslogic Offers NVIDIA Jetson-Based Embedded System for Railway
BADEN-DÄTTWIL, Switzerland, Aug.18, 2022 -- As a Preferred Partner in the NVIDIA Partner Network, Syslogic is offering AI-assisted embedded computers. The company’s AI Railway computers are the first NVIDIA Jetson-based systems certified and approved for the railway industry. They ...

JEDEC Updates Universal Flash Storage and Supporting Memory Interface Standard
August 18th, 2022 Comments Off on JEDEC Updates Universal Flash Storage and Supporting Memory Interface Standard
ARLINGTON, Va., Aug. 18, 2022 -- JEDEC Solid State Technology Association, a global leader in the development of standards for the microelectronics industry, has announced the publication of JESD220F: Universal Flash Storage 4.0.  In addition, an update to the ...
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