TSMC Details Resolutions from Board of Directors Meeting 

HSINCHU, Taiwan, May 9, 2023 -- TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved the distribution of a NT$3.00 per share cash dividend for the first quarter of 2023, and set September 20, 2023 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be September 14, 2023. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (September 16 through September 20, 2023) for registration transfer, and the dividend will be paid on October 12, 2023. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be September 14, 2023. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be September 15, 2023.
2. Approved capital appropriations of approximately US$366.1 million for the purpose of fab construction and installation of fab facility systems.
3. Approved the issuance of unsecured corporate bonds in the domestic market for an amount not to exceed NT$60 billion to finance TSMC’s capacity expansion and/or pollution prevention related expenditures.
4. Approved TSMC’s “Corporate Governance Guidelines.”
5. Approved the promotion of Fab Operations I Fab 18A Senior Fab Director Mr. Ray Chuang to Vice President.

For information on TSMC’s most recent Revenue Report, click here.

About TSMC

TSMC (TWSE: 2330, NYSE: TSM) created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. TSMC served about 535 customers and manufactured more than 12,302 products for various applications covering a variety of end markets including smartphones, high performance computing, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 13 million 12-inch equivalent wafers in 2021. These facilities include four 12-inch wafer GIGAFAB fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as one 12-inch wafer fab at a wholly owned subsidiary, TSMC Nanjing Company Limited, and two 8-inch wafer fabs at wholly owned subsidiaries, WaferTech in the United States and TSMC China Company Limited.

Source: TSMC