Advanced Computing in the Age of AI | Sunday, May 5, 2024

Archives

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
April 26th, 2023 Comments Off on Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
SAN JOSE, Calif., April 26 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful ...

Flex Logix Announces InferX High Performance IP for DSP and AI Inference
April 25th, 2023 Comments Off on Flex Logix Announces InferX High Performance IP for DSP and AI Inference
MOUNTAIN VIEW, Calif., April 24, 2023 -- Flex Logix Technologies, Inc. today announced the availability of InferX IP & software for DSP and AI inference. InferX joins EFLX eFPGA as Flex Logix's second IP offering. It can be used ...

Tachyum Chooses SENKO’s SN Connectivity for Prodigy System
April 25th, 2023 Comments Off on Tachyum Chooses SENKO’s SN Connectivity for Prodigy System
LAS VEGAS, April 25, 2023 – Tachyum has entered into an agreement with Senko Advance Co., Ltd. for Optical Interconnect Solution for Prodigy systems enabling high-speed data transfer in data centers. The criterion for selection was the robustness, reliability, and versatility ...

Cepton Expands Its Chipset for Automotive Lidar with New Advanced Point Cloud Processor ASIC
April 20th, 2023 Comments Off on Cepton Expands Its Chipset for Automotive Lidar with New Advanced Point Cloud Processor ASIC
SAN JOSE, Calif., April 20, 2023 -- Cepton, Inc., a Silicon Valley innovator and leader in high performance lidar solutions, announced the release of Komodo, its proprietary lidar point cloud processor ASIC (Application-Specific Integrated Circuit) chip. Supported by Cepton’s ...

MLCommons: MLPerf Inference Delivers Power Efficiency and Performance Gains
April 5th, 2023 Comments Off on MLCommons: MLPerf Inference Delivers Power Efficiency and Performance Gains
April 5, 2023 — MLCommons, the leading open AI engineering consortium, announced today new results from the industry-standard MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to ...

Blue Ocean Smart System Unveils Chiplet-based Products Powered by VeriSilicon’s High-Performance Processors
March 31st, 2023 Comments Off on Blue Ocean Smart System Unveils Chiplet-based Products Powered by VeriSilicon’s High-Performance Processors
SHANGHAI, March 31, 2023 -- VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon, including the CC8400 General-Purpose Graphics ...

Cerebras Systems Releases 7 New GPT Models Trained on CS-2 Wafer-Scale Systems
March 28th, 2023 Comments Off on Cerebras Systems Releases 7 New GPT Models Trained on CS-2 Wafer-Scale Systems
SUNNYVALE, Calif., March 28, 2023 -- Cerebras Systems today announced it has trained and is releasing a series of seven GPT-based large language models (LLMs) for open use by the research community. This is the first time a company ...

Supermicro Releases New GPU Servers Featuring NVIDIA HGX and PCIe-Based H100 8-GPU Systems
March 21st, 2023 Comments Off on Supermicro Releases New GPU Servers Featuring NVIDIA HGX and PCIe-Based H100 8-GPU Systems
SAN JOSE, Calif., March 21, 2023 -- Supermicro, Inc., a Total IT Solution Provider for AI/ML, Cloud, Storage, and 5G/Edge, today has announced that it has begun shipping its top-of-the-line new GPU servers that feature the latest NVIDIA HGX ...

Exxact Joins Supermicro’s Test Drive Program to Enable Remote Development on NVIDIA H100-Powered Servers
March 21st, 2023 Comments Off on Exxact Joins Supermicro’s Test Drive Program to Enable Remote Development on NVIDIA H100-Powered Servers
FREMONT, Calif., March 21, 2023 -- Exxact Corporation, a leading provider of high-performance computing (HPC), artificial intelligence (AI), and data center solutions, announced their participation in Supermicro's GPU Test Drive program to trial accelerated development on NVIDIA H100 GPU-powered ...

DFI Reveals PCSF51 SBC with AMD Ryzen R2000 Processor for Industrial Applications
March 13th, 2023 Comments Off on DFI Reveals PCSF51 SBC with AMD Ryzen R2000 Processor for Industrial Applications
TAIPEI, Taiwan, March 13, 2023 -- DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by AMD Ryzen Embedded R2000 Processor, the PCSF51 ...
Page 19 of 540« First...10...1718192021...304050...Last »
EnterpriseAI