Advanced Computing in the Age of AI | Friday, August 19, 2022

IC packaging

Intel Advances in DoD’s Chip Packaging Push

Developing new capabilities for integrating complex semiconductor devices such as chiplets into a single package is seen as one way of reviving the U.S. chip manufacturing. Recent funding proposals ...Full Article

Chip Proposals Seek to Revive U.S. Manufacturing

Legislation introduced in the U.S. House and Senate seeks to revive the U.S. semiconductor industry via a roughly $12 billion spending package and tax incentives designed to promote technology ...Full Article
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