Happening Now
Thursday, September 21- Red Hat Collaborates with Intel to Deliver Open Source Industrial Automation to the Manufacturing Shop Floor
- Oracle Cloud Infrastructure Bolsters AI Capabilities with NVIDIA H100 and Upcoming L40S GPUs
- RelationalAI to Host ‘The Promise of AI and Relational Knowledge Graphs’ Webinar
- TruEra Launches Comprehensive AI Tool with Enhanced Capabilities to Address LLM Risks and Enhance Development
- Galileo Introduces LLM Studio: Enhanced Modules to Fine-tune, Prompt, and Monitor Generative AI Outputs
- New MITRE-Harris Poll Reveals Decline in Public Trust of AI Technologies from Last Year
- Prominent Authors File Class Action Against OpenAI Alleging Copyright Infringement Through LLMs
- Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
- IBM Commits to Train 2M in Artificial Intelligence in 3 Years, with a Focus on Underrepresented Communities
- Chan Zuckerberg Science to Build AI GPU Cluster to Model Cell Systems
- Sylabs Unveils SingularityCE 4.0, Bridging HPC Performance with Enterprise Flexibility via OCI Interoperable Containers
- AMD Accelerates Innovation at the Edge with Kria K24 SOM and Starter Kit for Industrial and Commercial Applications
- SambaNova Unveils New AI Chip, the SN40L, Powering Its Full Stack AI Platform
- Anyscale Partners with NVIDIA to Supercharge LLM Performance and Efficiency
- AMD Completes 4th Gen EPYC Family with the AMD EPYC 8004 Processors, Purpose Built for Cloud and Edge
- University of Bristol to Host Isambard-AI Supercomputer, Marking a New Era in AI and HPC
- Intel Unveils Glass Substrates to Meet Demand for More Powerful Compute
- Writer Announces $100M Series B to Help Deliver Generative AI to the Enterprise
- TYAN Adopts New AMD EPYC 8004 Series Processors for Diverse Cloud and Edge Server Deployments
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Contributors
Tiffany TraderEditorial DirectorJaime HamptonManaging EditorJohn RussellContributing EditorAlex WoodieContributing EditorDrew JollyEditorial AssistantDouglas EadlineContributing EditorUpcoming Events
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September 19 @ 8:00 am - September 21 @ 5:00 pm -
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September 20 - September 21 -
IoT World and the AI Summit 2023
September 20 @ 8:00 am - September 21 @ 5:00 pm -
Call & Contact Center Expo
September 27 - September 28 -
AI World Government 2023
October 6 @ 8:00 am - October 7 @ 5:00 pm
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3D design
Running FEA Pre-Processing, Analysis and Post-Processing in One Design Environment
IronCAD, LLC, and NEi Software team up to provide NEi Nastran for IronCAD.Full Article
Dassault Innovates for the Future
Thanks to the design arm of a small French plane maker, companies like Boeing have been able to replace costly physical testing with precise, efficient computer-based techniques.Full Article