Archives
Cornelis Networks Announces Upcoming Release of Omni-Path Express HPC Interconnect
June 28th, 2021
WAYNE, Pa., June 28, 2021 -- ISC21 -- Cornelis Networks, a technology leader delivering purpose-built, high-performance fabrics for High Performance Computing (HPC), High Performance Data Analytics (HPDA), and Artificial Intelligence (AI), today announced the upcoming release of a new ...
Rensselaer Researcher: Intelligence-Sharing Tools Will Enable Smarter Devices
June 22nd, 2021
TROY, N.Y., June 22, 2021 -- Artificial intelligence and machine learning are revolutionizing the ways in which we live, work, and spend our free time, from the smart devices in our homes to the tasks our phones can carry ...
Intel Announces Network Deployments, Intel Network Platform at its MWC 2021 Event
June 21st, 2021
June 21, 2021 -- Today as part of its MWC 2021 virtual event, Intel showcased multiple network deployments powered by its technology and unveiled the Intel Network Platform. It also announced new additions to its product portfolio for 5G ...
IBM Closes Acquisition of Turbonomic to Deliver AIOps for Hybrid Cloud
June 21st, 2021
ARMONK, N.Y., June 21, 2021 -- IBM (NYSE: IBM) has announced the closing of its acquisition of Turbonomic, Inc., an Application Resource Management (ARM) and Network Performance Management (NPM) software provider based in Boston, MA. The close of the ...
Rambus to Acquire PLDA, Extending Leadership with CXL and PCI Express Digital IP
June 16th, 2021
SAN JOSE, Calif., June 16, 2021 -- Rambus Inc., a provider of industry-leading chips and silicon IP making data faster and safer, today announced it has signed an agreement to acquire PLDA, an industry leader in Compute Express Link ...
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Validating 7.2 Gbps HBM3 Controller
June 10th, 2021
HSINCHU, Taiwan, June 10, 2021 -- Global Unichip Corp. (GUC), an Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs. The ...
Point 2 Technology Introduces Low Power 400G Active Electrical Cable for HPC, Data Centers
June 9th, 2021
SAN JOSE, Calif., June 9, 2021 -- Point 2 Technology, a leading provider of high performance, low power connectivity solutions for Cloud and 5G infrastructure, introduced its first 400GBASE-SR4 Active Electrical Cable (AEC) for use in Distributed Disaggregated Chassis ...
Avicena Unveils LightBundle Chip Interconnect Technology with Lower Power Consumption
June 9th, 2021
MOUNTAIN VIEW, Calif., June 9, 2021 -- Avicena Inc., a privately held company in Mountain View, CA, unveils LightBundle, a highly parallel optical interconnect technology targeting up to 10 meters reach for chip-to-chip interconnects in distributed computing, processor-to-memory disaggregation, ...
CW-WDM MSA Consortium Releases New Specification for Multi-Wavelength Optical Laser Sources
June 8th, 2021
SANTA CLARA, Calif., June 8, 2021 – The CW-WDM MSA (Continuous-Wave Wavelength Division Multiplexing Multi-Source Agreement) Group, dedicated to defining and promoting specifications for multi-wavelength advanced integrated optics, today announced the release of its first official specification for 8, 16, and ...
Synopsys Announces DesignWare Low Latency Die-to-Die Controller IP
June 4th, 2021
June 4, 2021 -- Synopsys, Inc. announced its new DesignWare Die-to-Die Controller IP, which complements the company's existing 112G USR/XSR PHY IP for a complete die-to-die IP solution. With the complete IP solution, designers benefit from a low-latency, high-bandwidth ...